Chinese scientists have developed the two-dimensional (2D) semiconductor microprocessor (2D) the most complex in the world, with the chip that enters the production of pilot.
Details of chipWednesday in the Reading Committee review, which is less than a nanometer, was published in the newspaper evaluated by peers. Its most notable progress is that the manufacture of the chip is not based on an advanced extreme ultraviolet (Euv) Lithography, open a new independent path for China in semiconductor innovation.
While the silicon -based integrated circuits approach the physical limits of miniaturization, researchers from around the world turned to 2D materials, such as Molybden disulfide and tungstenide, to push the limits of flea performance.
Typically A single thickness atomThese materials offer remarkable physical properties, allowing improved scaling and functionality in new generation circuits.
Although growth in 2D material versions have been carried out in the last decade, so far, the most complex 2D 2D circuit – developed by the University of Technology in Vienna in 2017 – contained only 115 transistors.
“(This is because) the sculpture of the same object out of tofu is much more difficult than to sculpt it from Jade,” said the professor of Fudan University, Bao Wenzhong, describing the fragility and the challenges of the use of 2D semiconductors compared to traditional silicon silicon flea.