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You are at:Home»Technology»3M joins Consortium to speed up semiconductor technology in the United States-the company announcement
Technology

3M joins Consortium to speed up semiconductor technology in the United States-the company announcement

February 3, 2025003 Mins Read
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ST. Paul, Minn.
,, February 3, 2025 / Prnewswire / – 3m extends its commitment to the semiconductor industry by joining the American consortiumA strategic partnership of 12 main semiconductor suppliers. The consortium animates research and development in advanced technologies and new generation back-end treatment technologies anchored by a new advanced installation in Silicon Valley.



This strategic partnership of 12 main semiconductor suppliers will stimulate research and development in advanced technologies and new generation back-end treatment technologies anchored by a new advanced installation in Silicon Valley.

“As the requirements of AI and other high performance calculation technologies increase, suppliers must work together to provide complete solutions to difficult challenges over increasingly short time.” said Steven Vander LouwPresident of 3M of the platforms of display and electronics products. “Companies of American consortium Represent the leaders of American and Japanese innovation in a range of advanced packaging technologies. 3M is happy to join the consortium in order to bring our decades of expertise in materials science, on more than 50 technological platforms, to help meet these challenges. “”

For more than 25 years, 3M has been a supplier of materials and treatment aids for semiconductor polishing, advanced packaging and flea transport applications. Team with industry leaders continues to strengthen 3M engagement to be an integrated total solutions supplier for the semiconductor industry.

The consortium was founded in 2023 and directed by Japan-Res Resonac, a world leader in the semiconductor and electronics industry.

“We are delighted to welcome 3m in the American consortium“said Hidenori AbeCTO for semiconductor materials, Resonac. “The expertise of 3M in materials science and commitment to innovation in advanced solutions of devices and packaging processes will be an asset while we work together to resolve difficult technical and integration challenges for the customers on land in The United States. “”

The new R&D installation of the American consortium should be unveiled later this year in collaboration with a public launch event.

Learn more about Semiconductors Advanced Packaging Technologies on 3m.com.


About 3m
3M thinks that science helps to create a brighter world for everyone. By unlocking the power of people, ideas and science to reinvent what is possible, our world team uniquely addresses the opportunities and challenges of our customers, communities and planet. Learn how we work to improve lives and make the next step 3m.com/news.


On the Resonac group::

The Resonac group has been established in January 2023 Due to the integration of Showa Denko group and the Showa Denko materials group (ancient Hitachi chemical group). Annual sales of semiconductors and electronic materials in the group are approximately 340 billion yen. The group is recognized for its wide range of semiconductor materials for Back-End processes, which have a higher market share on the global scale. The integration of the two companies allowed Resonac group To design and develop materials internally, from raw materials to finished products. The new trade name “Resonac” was created as a combination of two English words, namely the word “resonant” and “C” from the first letter of chemistry. The Resonac group Tiri actively has started from its co-creative platform to accelerate technological innovation with semiconductor manufacturers, material manufacturers and equipment manufacturers in Japan and around the world.



3m (prnewsfoto / 3m)


Cission Show original content to download the multimedia:https://www.prnewswire.com/News-releases/3m-joirs-consortium-to-accelerate-semiconductor-technology-in-the-us-302365932.html

SOURCE 3M company

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